Compliant Mechanisms
ISBN: 978-03-675-6996-9
Format: 15.2x22.9cm
Liczba stron: 564
Oprawa: Miękka
Wydanie: 2022 r.
Język: angielski
Dostępność: dostępny
<P>With a rigorous and comprehensive coverage, the second edition of <I>Compliant Mechanisms: Design of Flexure Hinges</I> provides practical answers to the design and analysis of devices that incorporate flexible hinges. Complex-shaped flexible-hinge mechanisms are generated from basic elastic segments by means of a bottom-up compliance (flexibility) approach. The same compliance method and the classical finite element analysis are utilized to study the quasi-static and dynamic performances of these compliant mechanisms. This book offers easy-to-use mathematical tools to investigate a wealth of flexible-hinge configurations and two- or three-dimensional compliant mechanism applications.</P>
<P></P>
<P>FEATURES</P>
<UL>
<P>
<LI>Introduces a bottom-up compliance-based approach to characterize the flexibility of new and existing flexible hinges of straight- and curvilinear-axis configurations</LI>
<P></P>
<P>
<LI>Develops a consistent linear lumped-parameter compliance model to thoroughly describe the quasi-static and dynamic behavior of planar/spatial, serial/parallel flexible-hinge mechanisms</LI>
<P></P>
<P>
<LI>Utilizes the finite element method to analyze the quasi-statics and dynamics of compliant mechanisms by means of straight- and curvilinear-axis flexible-hinge elements</LI>
<P></P>
<P>
<LI>Covers miscellaneous topics such as stress concentration, yielding and related maximum load, precision of rotation of straight- and circular-axis flexible hinges, temperature effects on compliances, layered flexible hinges and piezoelectric actuation/sensing</LI>
<P></P>
<P>
<LI>Offers multiple solved examples of flexible hinges and flexible-hinge mechanisms.</LI>
<P></P></UL>
<P></P>
<P>This book should serve as a reference to students, researchers, academics and anyone interested to investigate precision flexible-hinge mechanisms by linear model-based methods in various areas of mechanical, aerospace or biomedical engineering, as well as in robotics and micro-/nanosystems.</P>